are removed using the appropriate EPP command, as specified by RFC 5910. Only the sponsoring registrar can request a DS record be removed, and then only if ...

https://www.apple.com/jp/legal/intellectual-property/tld/dps/

of the separated materials individually. • A semiconductor package contains many homogeneous materials that include the mold compound, die attach adhesive, ...

https://www.apple.com/jp/environment/pdf/Apple_Regulated_Substances_Specification_Sept2018.pdf