Tor Myhren is Apple’s vice president of Marketing Communications and a member of Apple’s executive leadership team. Learn more about Tor.。
Legal Open Menu Close Menu ハードウェア ソフトウェア セールス&サポート インターネットサービス 知的財産 その他の関連情報 DNSSEC Practice Statement for .Apple 1. Introduction 1.1. Overview Apple will s...
https://www.apple.com/jp/legal/intellectual-property/tld/dps/
with a gift receipt, Apple will offer you an Apple Gift Card. Opened software cannot be returned if it contained a seal with the software license on the out...
https://www.apple.com/jp/legal/sales-support/sales-policies/retail-jp.html
to align with a satellite. On initial connection, iPhone will package and send the user’s on-iPhone questionnaire responses, location, battery status, and a...
requirements to ensure the protection of its employees. Broken OLEDs must be handled properly to ensure the safety of your employees and mitigate any hazard...
to an average 50 percent water reuse rate by 2030. Learn more › Package and Ship The packaging is 100 percent fiber-based and uses only recycled or responsi...
https://www.apple.com/jp/environment/pdf/products/iphone/iPhone_Air_PER_Sept2025.pdf
to an average 50 percent water reuse rate by 2030. Learn more › Package and Ship The packaging is 100 percent fiber-based and uses only recycled or responsi...
https://www.apple.com/jp/environment/pdf/products/iphone/iPhone_17_PER_Sept2025.pdf
and drives participants to an average 50 percent water reuse rate by 2030. Learn more › Package and Ship The packaging is 100 percent fiber-based and uses o...
water reuse rate by 2030. Learn more › Package and Ship The packaging is 100 percent fiber-based and uses only recycled or responsibly sourced fibers.4 100%...
https://www.apple.com/jp/environment/pdf/products/notebooks/MacBook_Pro_14-inch_M5_PER_Oct2025.pdf
of the separated materials individually. • A semiconductor package contains many homogeneous materials that include the mold compound, die attach adhesive, ...
https://www.apple.com/jp/environment/pdf/Apple_Regulated_Substances_Specification_Sept2018.pdf